UV Spectrophometer(K LAB) Catalog

첨부파일  KLAB_General_Catalog.pdf (7.4 MB)

Package decapsulation (패키지 디캡)

Package decapsulation (패키지 디캡) Writer 관리자 Date 2023-04-24 10:26:42 Package decapsulation이란 IC 분석에 하나의 방법으로

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on

Delid and Decap

What is Decapsulation? The term “decapsulation” can refer to a procedure performed on either hermetic

High Temperature Epoxy [ion milling]

Epoxy는 일반적인 상황에서는 밀착력이 우수하며 투명도가 좋아 샘플 분석에 용이한 제품입니다. 다만 Epoxy는 여러 종류가