Tài liệu kỹ thuật

UV Spectrophometer(K LAB) Catalog
23/05/2025
Package decapsulation (패키지 디캡)
23/05/2025
THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY
23/05/2025
Delid and Decap
23/05/2025
High Temperature Epoxy [ion milling]
23/05/2025

Mặt cắt ngang

UV Spectrophometer(K LAB) Catalog
23/05/2025
Package decapsulation (패키지 디캡)
23/05/2025
THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY
23/05/2025
Delid and Decap
23/05/2025
High Temperature Epoxy [ion milling]
23/05/2025

Kính hiển vi / Lắp đặt và sửa chữa thiết bị

UV Spectrophometer(K LAB) Catalog
23/05/2025
Package decapsulation (패키지 디캡)
23/05/2025
THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY
23/05/2025
Delid and Decap
23/05/2025
High Temperature Epoxy [ion milling]
23/05/2025